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dsCORE
MCU Solutions
ESI introduces a new Microchip based single board
microcomputer solutions
targeted for embedded applications
For Immediate Release: 18 November, 2006
Mississauga, Ontario, Canada:
Embedded Sense, Inc. introduced today a new line of single
board computers, based on the new Microchip dsPIC33F line of
16-Bit microcomputers, targeted at OEM applications. The
first in the series of two planned platforms, the
dsCORE E8100
is has
been released for production and available in pre-production
evaluation quantities for qualified customers directly from
Embedded Sense, Inc. Final production versions are planned
for release in 1Q 2007.
The dsCORE E8100 is the first single board dsPIC33F solution
available in the marketplace. It combines the advanced
processing capabilities and flexible architecture of the
dsPIC33F with all necessary input and output buffers,
communications drivers and a high current, filtered and
regulated power supply. The dsCORE E8100 includes dual CAN
drivers and dual software selectable RS-232/RS-485 drivers,
a choice of 8 or 16 analog input buffers, 8 PWM output
channels and up to 56 discrete I/O points all in a package
the size of a credit card.
According to Frank Gerlach, President of Embedded Sense,
the dsCORE E8100 is “a one-step solution to that reduces
design risk to zero, while shortening development cycles and
accelerating time to market for any product”.
Although well suited for integration into many product
categories, the dsCORE E8100 will certainly be of particular
interest to developers of M2M, Industrial Automation,
Instrumentation, Energy Management, Wireless, Data
Collection, Asset Management and Security products due to
it’s leading edge processing power and highly flexible
communications and Input/Output options.
The dsCORE E8100 is priced in single unit quantities at US$199,
with price discounts applied to quantity purchases.
Production licenses are available for high volume production
requirements.
Embedded Sense, Inc. (ESI)
is a premier technology partner specializing in leveraging
embedded processing, interface, sensing and wireless
expertise into product solutions for global customers in the
military, industrial/commercial and medical markets. ESI
also provides selected technologies which are targeted as
product building blocks for the OEM market through a
subsidiary B2B website located at WWW.ESIPCB.COM.
FOR MORE INFORMATION CONTACT:
C. A. (Chris) Omiecinski
Business Development
(905) 286 1750 Ext. 229
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